Renesas Emulation Pod M30100T3-RPD-E Informações Técnicas descarregar pdf (Página 17)

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Chapter 2. Preparation

This chapter describes the package components, the system configuration and the preparation for using this product for the

first time.

2.1 Package Components..................................................................................................................16

2.2 Other Tool Products Required for Development........................................................................16

2.3 Name of Each Part...................................................................................................................... 17

(1) System Configuration ........................................................................................................... 17

2.4 When Using the Emulator for the First Time ............................................................................. 18

(1) Making the MCU File........................................................................................................... 18

(2) Setting the Work Area .......................................................................................................... 18

(3) Downloading Firmware ........................................................................................................19

(4) Self-check ............................................................................................................................. 19

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Renesas Emulation Pod M30100T3-RPD-E Informações Técnicas Página 17