
M16C/30P Group 5. Electrical Characteristics
Rev.1.22 Mar 30, 2007 Page 52 of 53
REJ03B0088-0122
Figure 5.13 Timing Diagram (5)
BCLK
CSi
td(BCLK−CS)
30ns.max
ADi
td(BCLK−AD)
30ns.max
ALE
30ns.max
th(BCLK−ALE)
−4ns.min
RD
30ns.max
th(BCLK−RD)
0ns.min
th(BCLK−AD)
0ns.min
th(BCLK−CS)
0ns.min
Hi−Z
DBi
tsu(DB−RD)
50ns.min
th(RD−DB)
0ns.min
tcyc
BHE
Read timing
WR,WRL,
WRH
30ns.max
th(BCLK−WR)
0ns.min
BCLK
CSi
td(BCLK−CS)
30ns.max
ADi
td(BCLK−AD)
30ns.max
ALE
30ns.max
td(BCLK−ALE)
th(BCLK−ALE)
−4ns.min
th(BCLK−AD)
0ns.min
th(BCLK−CS)
0ns.min
tcyc
th(WR−AD)
BHE
td(BCLK−DB)
40ns.max
4ns.min
th(BCLK−DB)
td(DB−WR)
(0.5
× tcyc−40)ns.min
(0.5
× tcyc−10)ns.min
th(WR−DB)
DBi
Write timing
td(BCLK−ALE)
td(BCLK−RD)
(0.5 × tcyc−10)ns.min
td(BCLK−WR)
0ns.min
th(RD−AD)
tac2(RD−DB)
Hi−Z
Memory Expansion Mode, Microprocessor Mode
(for 1-wait setting and external area access)
(1.5 × tcyc−60)ns.max
tcyc=
1
f(BCLK)
VCC1=VCC2=3V
Measuring conditions
· V
CC1=VCC2=3V
· Input timing voltage : V
IL=0.6V, VIH=2.4V
· Output timing voltage : V
OL=1.5V, VOH=1.5V
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