Renesas R8C/17 Informações Técnicas descarregar pdf (Página 3)

Rev.2.00 Jan 30, 2006 Page 1 of 35

REJ03B0101-0200

1. Overview

This MCU is built using the high-performance silicon gate CMOS process using the R8C/Tiny Series CPU

core and is packaged in a 20-pin plastic molded LSSOP. This MCU operates using sophisticated

instructions featuring a high level of instruction efficiency. With 1 Mbyte of address space, it is capable of

executing instructions at high speed.

Furthermore, the data flash ROM (1KB × 2blocks) is embedded in the R8C/17 group.

The difference between the R8C/16 and R8C/17 groups is only the existence of the data flash ROM. Their

peripheral functions are the same.

1.1 Applications

Electric household appliance, office equipment, housing equipment (sensor, security), general industrial

equipment, audio, etc.

REJ03B0101-0200

Rev.2.00

Jan 30, 2006

R8C/16 Group, R8C/17 Group

SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER

1 2 3 4 5 6 7 8 ... 39 40

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