Renesas H8S/2276R Informações Técnicas descarregar pdf (Página 17)

2.3 Recommended Dimensions for User System Mount Pad

Figure 6 shows the recommended dimensions for the mount pad (footprint) for the user system with

an IC socket for a TFP-100G package (NQPACK100SE: manufactured by Tokyo Eletech

Corporation). Note that the dimensions in figure 6 are somewhat different from those of the actual

chip's mount pad.

Figure 6 Recommended Dimensions for Mount Pad

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Renesas H8S/2276R Informações Técnicas Página 17