Renesas PCA7429G02 Informações Técnicas descarregar pdf (Página 143)

21. PACKAGE OUTLINE

SDIP42-P-600-1.78

Weight(g)

–

JEDEC Code

4.1

EIAJ Package Code

Lead Material

Alloy 42/Cu Alloy

42P4B

Plastic 42pin 600mil SDIP

Symbol

Min Nom Max

Dimension in Millimeters

0.51 – –

–3.8–

0.35 0.45 0.55

0.9 1.0 1.3

0.63 0.73 1.03

0.22 0.27 0.34

36.5 36.7 36.9

12.85 13.0 13.15

– 1.778 –

– 15.24 –

3.0 – –

0° –15°

– – 5.5

SEATING PLANE

SSOP42-P-450-0.80

Weight(g)

–

JEDEC Code

0.63

EIAJ Package Code

Lead Material

Alloy 42

42P2R-A/E

Plastic 42pin 450mil SSOP

Symbol

Min Nom Max

Dimension in Millimeters

–

.250

.050

.130

.317

.28

–

.6311

.30

–

.271

–

.02

.30

.150

.517

.48

.80

.9311

.50

.7651

–

.4311

–

.42

–

.40

.20

.717

.68

–

.2312

.70

–

.150

–

–.50–

–

0° –10°

42 22

Recommended Mount Pad

Detail F

Detail G

–

0.75

–

0.9

140

SINGLE-CHIP 8-BIT CMOS MICROCOMPUTER with CLOSED CAPTION DECODER

and ON-SCREEN DISPLAY CONTROLLER

M37272M6/M8–XXXSP/FP, M37272MA–XXXSP

M37272E8SP/FP, M37272EFSP

MITSUBISHI MICROCOMPUTERS

Rev. 1.4

1 2 ... 138 139 140 141 142 143 144 145

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